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Xianyi Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Solder Wire & Paste
Noble Metal Bonding Wire & Ribbon
Flux Paste
Interconnecting Devices for Electronic Packaging
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
Nano-Ag Paste

Solder Preforms

The solder preform is customized solder with different shapes. Xian Yi can provide solder preforms in a variety of sizes with high machining accuracy and excellent soldering performance, suitable for different industry applications.
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Interconnecting Materials for Electronic Packaging Interconnecting Devices for Electronic Packaging Electronic Packaging Materials for Third-Generation Power Semiconductor
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020-34698382

Email：info@xianyichina.com
Guangzhou Xianyi Electronic Technology Co., Ltd. Address：3/F, Building5& 6, 16 Lianyun 1st heng Road, Shiqi Town, Panyu District, Guangzhou, Guangdong, China