Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
AMB Ceramic Substrates
Active Metal Brazing (AMB) ceramic substrate usually used as the package substrate for high-voltage power devices and it is specially suitable for the package demand of the third-generation semiconductor SiC devices..
Features
lSelf-developed active brazing material
lWhole process flow self-controlled
lUltra-low interface void, high thermal conductivity
lExcellent temperature shock resistant, high reliability
Specifications
Ceramic/Copper Thickness Combinations
Surface Treatment of AMB Ceramic Substrates
Applications
New Energy Vehicle
Rail Traffic
Smart Grid
Photovoltaic and Energy Storage
