Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
Nano-Ag Paste
Nano-Ag paste is compatible with dispensing and printing process and equipments for conventional solder paste.It is especially suitable for the third generation semiconductor application.
Features
l Self-developed nano-Ag dispersing system, RoHS compliant
l Pressureless or pressure-assisted sintering
l Low sintering temperature (200℃) and high working temperature
l High connecting strength, excellent electrical and thermal conductivity
l Alternative to high-lead solder
l No organic residue, cleaning free
Specifications
Applications
High Power Semiconductor Device Packaging
