ty8天游线路检测中心-天游8线路检测中心
Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,
Providing technical consulting service and solutions
Home
About us
About Us
Honor & Qualification
Testing Center
Testing Equipment
Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders
Gold-Based Solders
Silver-Based Solders
Indium-Based Solders
Tin-Based Solders
Flux Coated Solder Preforms
Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Solder Wire & Paste
Noble Metal Bonding Wire & Ribbon
Flux Paste
Interconnecting Devices for Electronic Packaging
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
Nano-Ag Paste
Customer
Contact us
Guestbook
Contact Us
中文
close
Overseas Sales
Southwest & Northwest China
North & Northeast China
South & Central China
East China
online service
Xianyi Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders
Gold-Based Solders
Silver-Based Solders
Indium-Based Solders
Tin-Based Solders
Flux Coated Solder Preforms
Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Solder Wire & Paste
Noble Metal Bonding Wire & Ribbon
Flux Paste
Interconnecting Devices for Electronic Packaging
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
Nano-Ag Paste
GB/T 19001-2016 idt ISO 9001:2015 Environmental Management System
